Looped cooling system

ABSTRACT

A system may include an evase through which heated airflow flows therethrough when the system is in operation; and a coil assembly coupled with the evase and a heat rejection system and configured, when the system is in operation, to: receive a refrigerant; receive the heated airflow from the evase; transfer heat from the heated airflow to the refrigerant to reduce a temperature of the airflow; provide an egress through which the cooled airflow exits therefrom; and provide the refrigerant, after transferring the heat from the heated airflow to the refrigerant, to the heat rejection system to permit the heat rejection system to remove heat from the refrigerant to reduce a temperature of the refrigerant, and to provide the refrigerant, after removing the heat from the refrigerant, to the coil assembly.

BACKGROUND

Cooling systems are used to reduce temperatures of electronic devices and electronic components within the electronic devices. For example, an electronic device, such as a server device, an uninterruptible power supply (UPS) device, or the like, may include input fans to receive cool air and exhaust fans to output hot air, thereby cooling an interior of the electronic device. The electronic device is sometimes coupled with an air conditioning system to provide the cool air. Cooling systems often require substantial power consumption, thereby increasing costs for a user of the cooling system and causing emissions (e.g., greenhouse emissions) as a result of the power consumption. Also, when an electronic device is provided with an increased electrical load (e.g., to compensate for a failure in a redundant electrical device), the cooling system is often unable to sufficiently cool the electronic device, thereby risking damage to the electronic device and/or components within the electronic device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an overview of an example implementation as described herein;

FIG. 2 illustrates an example environment in which systems and/or methods, described herein, may be implemented;

FIG. 3 illustrates an overview of an example looped cooling system as described herein;

FIG. 4 illustrates an example implementation as described herein;

FIG. 5 illustrates example components of a device illustrated in FIGS. 1-4;

FIG. 6 illustrates a graph of example temperature of airflow heated by a module, subject to a particular electrical load, and cooled by a looped cooling system; and

FIG. 7 illustrates a chart illustrating example power consumption of a looped cooling system and a non-looped cooling system.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following detailed description refers to the accompanying drawings. The same reference numbers in different drawings may identify the same or similar elements.

Systems and/or methods, as described herein, may provide a looped cooling system for a module (e.g., an electronic device). In some implementations, the module may provide an airflow (e.g., via an exhaust fan of the module) that is heated by components of the module (e.g., processors, circuit boards, interface cards, storage devices, removable media devices, power supplies, etc.). Heat from the airflow, provided by the module, may be transferred (e.g., via a cooling coil assembly) to a heat rejection system, thereby cooling the airflow (e.g., since heat has been transferred from the airflow to the heat rejection system). The airflow, after being cooled, may be provided back to the module as inlet air to be used to cool the module.

As used herein, the term “module” is to be broadly construed as a heat-emitting device, such as an uninterruptible power supply (UPS) device, a server device, a desktop computing device, an equipment rack/housing that includes multiple electronic devices, or a combination of these devices and/or some other type of heat-emitting device.

FIG. 1 illustrates an example implementation as described herein. In FIG. 1, airflows are represented by arrows and a relative temperature of airflow is proportionally represented by a darkness of the arrow. That is, the darker the arrow is, the higher the temperature of the airflow.

As shown in FIG. 1, a module 130 may include an input fan 132 to receive an airflow (e.g., to provide cooling to internal components of module 130) and an exhaust fan 134 to output heated airflow (e.g., airflow that is heated by the internal components of module 130 and is heated with respect to input airflow received by input fan 132). In some implementations, a looped cooling system 100 may include an evase 110 to receive the heated airflow, provided by exhaust fan 134, and to provide the heated airflow to a coil assembly 120. As shown in FIG. 1, evase 110 may be tapered in shape as to evenly distribute the heated airflow across coil assembly 120. For example, evase 110 may include a first width (e.g., W1) at a base portion of evase 110, a second width (e.g., W2) at top portion of evase 110, and a height (H) to form the tapered shape having an angled side with a particular angle (11).

In some implementations, coil assembly 120 may receive the heated airflow and may further receive a refrigerant (e.g., a liquid or vapor refrigerant, such as R134a refrigerant, a refrigerant that is provided by a heat rejection system, and/or some other refrigerant provided by some other source) to cool the heated airflow to form a cooled airflow (e.g., by transferring heat from the heated airflow to the refrigerant, thereby heating the refrigerant). The cooled airflow may be provided through an egress towards input fan 132. As used herein, the term “refrigerant” is be broadly construed as a fluid in a vapor or liquid state.

In some implementations, the refrigerant, after being heated, may be distributed across coil assembly 120 (e.g., in the form of a vapor) to a heat rejection system. In some implementations, heat from the heated refrigerant may be transferred to the heat rejection system (thereby cooling the heated refrigerant) and provided back to coil assembly 120 (e.g., after the heated refrigerant is cooled).

In some implementations, the heated airflow may be cooled via the refrigerant (e.g., by transferring heat from the heated airflow to the refrigerant) and provided back to input fan 132 as input airflow. As a result, input fan 132 may receive airflow having a substantially lower temperature than the airflow provided by exhaust fan 134, thereby cooling internal components of module 130 and recycling energy associated with air provided by exhaust fan 134. Further, looped cooling system 100 may cool the heated airflow without adding additional floor space.

While a particular arrangement of components is shown with respect to looped cooling system 100, in practice, looped cooling system 100 may include additional, fewer, or differently arranged components that what is shown in FIG. 1. Also, in practice, the proportions and shapes of the components may differ from what is shown (e.g., based on the size/shape of module 130).

FIG. 2 is a diagram of an example environment 200 in which systems and/or methods described herein may be implemented. As shown in FIG. 2, environment 200 may include looped cooling system 100, module 130, pump 210, and heat rejection system 220.

Looped cooling system 100 may include evase 110 and coil assembly 120. In some implementations, evase 110 may include a venting component to receive airflow from module 130 (e.g., airflow that is heated by components of module 130) and provide the airflow to coil assembly 120. In some implementations, evase 110 may distribute the airflow when providing the airflow to coil assembly 120 (e.g., to prevent backpressure of the airflow to module 130). Additional details regard evase 110 are described below with respect to FIG. 3.

Coil assembly 120 may include one or more components to receive airflow provided via evase 110. In some implementations, coil assembly 120 may receive a refrigerant to cool the airflow (e.g., transfer heat from the airflow to the refrigerant, thereby heating the refrigerant). For example, coil assembly 120 may receive a refrigerant (e.g., an R134a refrigerant and/or some other type of refrigerant). As described above, coil assembly 120 may distribute the heated refrigerant to heat rejection system 220. In some implementations, heat rejection system 220 may receive the heated refrigerant, remove heat from the heated refrigerant (e.g., to cool the heated refrigerant), and provide the cooled refrigerant back to coil assembly 120.

In some implementations, coil assembly 120 may include an electronically controlled inlet to receive a refrigerant and to control a size of the inlet to vary an amount of refrigerant that is received. Additionally, or alternatively, coil assembly 120 may include a manually controlled inlet or an inlet having a fixed size. In some implementations, the inlet size may be adjusted to adjust an amount of heat that is transferred to the refrigerant based on a capacity of heat that the heat rejection system is able to reject. Additional details regarding coil assembly 120 are described below with respect to FIG. 3.

Module 130 may include an electrical device, such as a UPS device, a server device, a desktop computing device, an equipment rack/housing that includes multiple electronic devices, or a combination of these devices and/or some other type of heat-emitting device. As described above, module 130 may receive an input airflow to cool internal components of module 130 and output the airflow (e.g., after the airflow has been heated) to looped cooling system 100.

Pump 210 may include a pumping device or a collection of pumping devices. In some implementations, pump 210 may include an electromechanical pump, or some other type of pump, that provides a refrigerant to coil assembly 210 (e.g., to cool an airflow). For example, pump 210 may provide a refrigerant (e.g., an initial refrigerant supply) to coil assembly 120. In some implementations, pump 210 may include a reservoir to store the refrigerant and to receive additional refrigerant to be provided (e.g., by heat rejection system 220 and/or provided by some other source) as refrigerant stored by the reservoir is consumed. In some implementations, the refrigerant maybe maintained above a dew-point of a facility in which pump 210 is implemented in order to prevent condensation. In some implementations, pump 210 may include one or more control valves to vary an amount of refrigerant provided to coil assembly 120. In some implementations, pump 210 may include control logic to control an opening size of the valves in order to vary the amount of refrigerant provided. Additionally, or alternatively, pump 210 may include a manual valve control to vary the amount refrigerant provided.

In some implementations, pump 210 may incur a particular load based on measure of heat to be dissipated from the heated airflow provided by module 130. In some implementations, additional pumps 210 may be provided to reduce the load on each pump 210. Additionally, or alternatively, additional pumps 210 may be provided to serve as redundancies in the event a particular pump 210 fails.

Heat rejection system 220 may include heat rejection components that may transfer heat from one medium to another medium (e.g., transfer heat from a heated refrigerant, provided by coil assembly 120, to a water supply). In some implementations, heat rejection system 220 may include a heat exchanger, a water supply, a reservoir, an air supply, a pump, a fan, and/or some other component to transfer heat. In some implementations, the components of heat rejection system 220 may vary based on a particular facility associated with environment 200.

As shown in FIG. 2, heat rejection system 220 may receive a heated refrigerant from coil assembly 120, remove heat from the heated refrigerant (e.g., to cool the refrigerant), and provide the refrigerant, after being cooled, to pump 210 such that the cooled refrigerant may be provided back to coil assembly 120. The cooled refrigerant may be provided in either a liquid state or a vapor state. For example, when the heated refrigerant is in the vapor state, heat rejection system 220 may remove heat from the heated refrigerant until the heated refrigerant changes state from a vapor to a liquid (e.g., via condensation). Alternatively, heat rejection system 220 may remove heat from the heated refrigerant until just before the heated refrigerant changes state from a vapor to a liquid. Additional details regarding the heat rejection system are described in greater with respect to FIG. 4.

The quantity of components, illustrated in FIG. 2, is not limited to what is shown. In practice, there may be additional components; fewer components; different components; or differently arranged components than illustrated in FIG. 2. For example, environment 200 may include multiple pumps 210 to provide a refrigerant to coil assembly 120 and/or to some other source.

In some implementations, one or more of the components of environment 200 may perform one or more functions described as being performed by another one or more of the components of environment 200. Also, multiple components may be provided to provide a redundancy function in the event that a component fails.

Components of environment 200 may interconnect via air duct systems, plumbing systems, and/or other facility systems associated with a particular facility in which the components of environment 200 are implemented. Also, components in environment 200 may be implemented in various locations of the particular facility.

FIG. 3 illustrates an overview of an example looped cooling system as described herein. As shown in FIG. 3, looped cooling system 100 may receive airflow from module 130. As shown in FIG. 3, looped cooling system 100 may include evase 110 and coil assembly 120. Coil assembly 120 may include surface 322, fins 324, coils 326, and headers 328.

Evase 110 may correspond to a venting device to receive airflow from module 130 and provide the airflow to coil assembly 120. In some implementations, evase 110 may include sheet metal formed in a truncated-pyramid shape to equalize air pressure in order to distribute the airflow to coil assembly 120. As shown in FIG. 3, evase 110 may be mounted to a top portion of module 130. For example, evase 110 may be welded to module 130. Additionally, or alternatively, evase 110 may include mounting hardware (e.g., mounting brackets, or the like) to mount to module 130. Additionally, or alternatively, evase 110 may include a sealing system (e.g., a sealing material and/or sealing hardware) to prevent the airflow from leaking between module 130 and evase 110. In some implementations, evase 110 may include one or more doors to allow access to evase 110 and to allow access to coil assembly 120. In some implementations, looped cooling system 100 may include a support abutting evase 110 and module 130 to restrain evase 110 in place and to counteract air pressure from within evase 110.

As shown in FIG. 3, evase 110 may include a first width (W1), a second width (W2), a height (H), a first depth (D1), and a second depth (D2). In some implementations, W1 may be less than a width of module 130 (e.g., such that evase 110 is offset from an edge of module 130 to provide access to module 130). In some implementations, width W1 and depth D1 may form a base area at a base portion of evase 110. In some implementation, the base area may be selected to create sufficient pressure of airflow, provided by module 130, such that heat from the airflow may received by coil assembly 120. In some implementations, the base area may be selected based on dimensions of module 130 and/or dimensions of an opening of module 130 where airflow is provided to evase 110. In some implementations, the base area may be selected based on height H. For example, the greater height H, the greater the pressure of the airflow may be at the base area such that heat from the airflow is received by coil assembly 120 (e.g., without creating backpressure of the airflow into module 130). In some implementations, height H may be selected based on a distance between a base portion of evase 110 to heat rejection system 220 and/or a height of coil assembly 120. In some implementations, the base area may be selected to compensate for a height restriction associated with a facility in which looped cooling system 100 is implemented.

In some implementations, width W2 and depth D2 may form a top area corresponding to an area of surface 322. In some implementations, the area may be selected to compensate for a quantity of coils 326 and/or for a quantity of fins 324. For example, the area may be proportional to the quantity of coils 326, the dimensions of coils 326, and/or the dimensions of fins 324 that may be provided. In some implementations, the top area may further be selected to prevent back pressure of airflow received from module 130. For example, the area may be inversely proportional to the back pressure. In some implementations, the top area may further be selected such that airflow is provided evenly across coils 326.

In some implementations, Φ may be based on width W1, width W2, and height H. For example, Φ may be 90 degrees when width W1 and width W2 are equal, greater than 90 degrees when width W2>width W1, and less than 90 degrees when width W2<width W1. In some implementations, Φ may be inversely proportional to height H, inversely proportional to W1, and proportional to W2. In some implementations, evase 110 may include additional components not shown in FIG. 3. For example, evase 110 may include a flange to receive surface 322.

Surface 322 may include a base and/or a frame disposed on a top portion of evase 110 to receive airflow from module 130 via evase 110. In some implementations, surface 322 may include a thermal conductive material (e.g., an aluminum alloy, copper, or the like) to absorb heat from the airflow and to provide the heat to fins 324.

Fins 324 may correspond to heat-sinking structures to receive heat, associated with airflow provided by module 130, and to dissipate and distribute the heat evenly to coils 326. In some implementations, fins 324 may include a thermal conductive material, such as an aluminum alloy, copper, or the like. In some implementations, fins 324 may be inclined at particular angles with respect to surface 322 and may be uniformly spaced apart across surface 322. The angles of the inclinations of fins 324 and/or the spacing of fins 324 may be selected such that heat from the airflow is directed towards coils 326.

Coils 326 may include one or more heat transfer coils to receive a refrigerant (e.g., a refrigerant from pump 210 and/or a refrigerant from heat rejection system 220) and to receive heat, associated with airflow provided by module 130, via surface 322 and fins 324. As shown in FIG. 3, coils 326 may be mounted to fins 324 (e.g., via spot-welding, via mounting brackets, and/or via some other technique) as to receive heat via fins 324. In some implementations, coils 326 may be curved. The curvature of coils 326 may be selected to optimize aeration of the airflow and to improve the contact of the airflow to coils 326 (e.g., such that heat from the airflow is transferred to the refrigerant received by coils 326). In some implementations, the curvature of coils 326 may direct the airflow towards coils 326 (e.g., as a result of the aeration associated with the curvatures).

In some implementations, the quantity of coils 326 provided may be based on an amount of airflow provided by module 130 and/or cooling capability requirements (e.g., an amount of heat that is to be dissipated from the airflow). For example, the quantity of coils 326 may be proportional to an amount of airflow output by module 130 and proportional to the amount of heat to be dissipated from the airflow. As an example, assume that module 130 outputs 12,000 cubic feet per minute (CFM) of airflow and that 60 kW of heat is to be dissipated. Further, assume that each coil is capable of dissipating 5 kW of heat and absorbing 1,000 CFM. Given these assumptions, 12 coils may be provided. In some implementations, the quantity of coils 326 may selected based on a quantity of pumps 210 provided. For example, the quantity of coils 326 may be proportional to the quantity of pumps 210.

In some implementations, the quantity of coils 326 provided may be based on some other factor, such as pressure drop requirements (e.g., an amount of pressure for airflow received by input fan 132 that may be relieved by coils 326 such that the pressure of the airflow received by input fan 132 is below a particular threshold).

Conversely, the quantity of coils 326 may be predetermined (or selected based on an area of surface 322) such that the design of the coils 326 may be determined. For example, assume that 15 coils 326 are selected and that 60 kW of heat is to be dissipated from 15,000 CFM of airflow. Given these assumptions, each of coils 326 may be designed to dissipate 5 KW of heat from 1,000 CFM of airflow.

In some implementations, coils 326 may include an inlet to receive the refrigerant via a hose connected to the inlet. The inlet may be provided at an interface connecting coils 326 to fins 324. In some implementations, pipes/hoses may be routed on an interior or exterior of evase 110 and connected to the inlets of coils 326 to supply the refrigerant.

As described above, the refrigerant may cool the airflow such that the cooled airflow may be provided back to module 130. As described above, heat from the airflow may be transferred to the refrigerant received by coils 326. The refrigerant, after receiving the heat from the airflow, may be received by headers 328 (e.g., in the vapor state). As an example, assume that the refrigerant, received by coils 326 (e.g., from pump 210), is in the liquid state. Given this assumption, heat from the airflow may change the state of the refrigerant from a liquid to a vapor to be received by headers 328. In another example, assume that the refrigerant, received by coils 326 (e.g., from pump 210), is in the vapor state. Given this assumption, heat from the airflow may be transferred to the refrigerant while the refrigerant is in the vapor state.

Headers 328 may include one or more vapor distributing structures to receive a vapor (e.g., a vapor corresponding to the refrigerant). In some implementations, headers 328 may include a thermal-conductive material to receive the refrigerant and to distribute the refrigerant (e.g., in the vapor state) evenly across a particular area. In some implementations, headers 328 provide the refrigerant to heat rejection system 220 to allow heat rejection system 220 to remove heat from the refrigerant and provide the refrigerant, after removing the heat, back to coils 326.

The quantity of components, illustrated in FIG. 3, is not limited to what is shown. In practice, there may be additional components; fewer components; different components; or differently arranged components than illustrated in FIG. 3.

FIG. 4 illustrates an example implementation as described herein. As shown in FIG. 4, pump 210 may provide a refrigerant to coil assembly 120 to transfer heat from airflow provided to coil assembly 120 by module 130. As described above, coil assembly 120 may receive the refrigerant and may provide a heated refrigerant to heat rejection system 220 (e.g., when the heat is transferred from the airflow to the refrigerant). As shown in FIG. 4, heat rejection system 220 may include heat exchanger 410, water system 420, reservoir 430, and air supply 440.

Heat exchanger 410 may include a heat transfer device or a collection of heat transfer devices. In some implementations, heat exchanger 410 may include a shell and tube heat exchanger, a fluid heat exchanger, a phase-chase heat exchanger, a water-side heat exchanger, or a combination of these and/or some other type of heat exchanger. In some implementations, heat exchanger 410 may include a water inlet, a water outlet, a refrigerant inlet, and a refrigerant outlet. In some implementations, heat exchanger 410 may include a coil having the water inlet and water outlet.

In some implementations, heat exchanger 410 may receive a refrigerant (e.g., a heated refrigerant from coil assembly 120) via the refrigerant inlet, remove the heat from the refrigerant, and provide the refrigerant, after removing the heat, to reservoir 430. For example, heat exchanger 410 may receive a water supply (e.g., from water system, 420) via the water inlet to transfer the heat from the refrigerant to water. The water, after being heated, may be discarded back to water system 420. In some implementations, heat exchanger 410 may include a controller to electronically control an inlet and/or an outlet to adjust the size of the inlet/outlet to vary an amount of refrigerant and/or water that is received or vary an amount of refrigerant or water that is output by heat exchanger 410. Additionally or alternatively, heat exchanger 410 may include manually operable inlets/outlets or include inlets/outlets of a fixed size.

Water system 420 may include a water supply to provide a water source to heat exchanger 410. In some implementations, water system 420 may include a water cooling device and/or a temperature controller to regulate an amount of water provided to heat exchanger 410 and/or a temperature of water provided to heat exchanger 410. In some implementations, water system 420 may connect with a private and/or a publicly operated water utility system. In some implementations, water system 420 may continuously circulate water to heat exchanger 410 by receiving heated water discarded by heat exchanger 410 and providing chilled water, having a particular temperature, to heat exchanger 410.

Reservoir 430 may include a tank, a container, or the like to receive a refrigerant from heat exchanger 410 and to provide the refrigerant to coil assembly 120 (e.g., via pump 210). In some implementations, reservoir 430 may include an inlet to receive the refrigerant and an outlet to provide the refrigerant. In some implementations, reservoir 430 may include a controller to electronically control an inlet and/or an outlet to adjust the size of the inlet/outlet to vary an amount of refrigerant that is received/provided by reservoir 430. Additionally or alternatively, heat exchanger 410 may include manually operable inlets/outlets or include inlets/outlets of a fixed size.

Air supply 440 may include an air cooling system or a collection of air cooling systems. For example, air supply 440 may include a heating, ventilation, and air conditioning (HVAC) unit, an evaporative air cooler, or some other type of air cooling system. In some implementations, air supply 440 may receive ambient air and provide a corresponding vapor. In some implementations, air supply 440 may include a controller to electronically control an inlet and/or an outlet to vary an amount of ambient air that is received or vary an amount of vapor that is output by air supply 440. Additionally or alternatively, air supply 440 may include manually operable inlets/outlets or include inlets/outlets of a fixed size.

As shown in FIG. 4, coil assembly 120 may receive airflow from module 130. As described above, the airflow may be heated by components of module 130. As further shown in FIG. 4, coil assembly 120 may receive a refrigerant stored by pump 210. For example, coil assembly 120 may receive a refrigerant, such as an R134a refrigerant and/or some other type of refrigerant. As described in greater detail below, the refrigerant may be recycled via heat rejection system 220. In some implementations, pump 210 may provide an initial supply of refrigerant to coil assembly 120.

In some implementations (e.g., when coil assembly 120 receives the airflow and the refrigerant), the refrigerant may cool the airflow by absorbing heat from the airflow. As shown in FIG. 4, coil assembly 120 may provide the cooled airflow to module 130 (e.g., to cool components of module 130 and output the airflow, after being heated by the components, back to coil assembly 120). As described above, the refrigerant, after absorbing heat from the airflow, may be distributed across coil assembly 120 and provided to heat rejection system 220 (e.g., to heat exchanger 410-1 of heat rejection system 220).

In some implementations, heat exchanger 410-1 may receive the heated refrigerant (e.g., the refrigerant after having absorbed the heat from the airflow) and may receive water from water system 420-1. Based on receiving the heated refrigerant and the water, heat exchanger 410-1 transfers the heat from the heated refrigerant to the water, thereby cooling the refrigerant. Further, heat exchanger 410-1 may discard the water (after transferring the heat to the water) back to water system 420-1 and/or to some other source. In some implementations, the refrigerant, after being cooled, may be provided to reservoir 430. In some implementations, the refrigerant, provided by heat exchanger 410-1, may correspond to the refrigerant provided by pump 210. As a result, the refrigerant may be recycled, thereby reducing consumption of the refrigerant.

In some implementations, air supply 440 may provide a vapor to heat exchanger 410-2. Heat exchanger 410-2 may receive the vapor from air supply 440 and may receive water from water system 420-2. Based on receiving the vapor and the water, heat exchanger 410-2 transfers the heat from the vapor to the water, thereby cooling the vapor. Further, heat exchanger 410-2 may discard water back to water system 420-2 and/or to some other source. In some implementations, the cooled vapor may be provided to reservoir 430. As shown in FIG. 4, reservoir 430 may receive cooled vapor from heat exchanger 410-1 and/or heat exchanger 410-2. In some implementations, reservoir may provide the cooled vapor to coil assembly 120 (e.g., via pump 210). In some implementations, the refrigerant, provided by pump 210, may include an initial supply of refrigerant and/or recycled refrigerant provided by heat rejection system 220.

The quantity of components, illustrated in FIG. 4, is not limited to what is shown. In practice, there may be additional components; fewer components; different components; or differently arranged components than illustrated in FIG. 4. For example, heat rejection system 220 may include any number or arrangement of components suitable for a particular facility in which looped cooling system 100 is implemented. In some implementations, one or more of the components shown of FIG. 4 may perform one or more functions described as being performed by another one or more of the components of FIG. 4.

In some implementations, multiple components may be integrated. For example, pump 210 may include components of heat exchanger 410 to receive a refrigerant, provided by coil assembly 120, remove heat from the refrigerant, and provide the refrigerant, after removing the heat, to coil assembly 120.

Components of FIG. 4 may interconnect via air duct systems, plumbing systems, and/or other facility systems associated with a particular facility in which the components of FIG. 4 are implemented. Also, components of FIG. 4 may be implemented in various locations of the particular facility.

FIG. 5 illustrates example components of a device 500 that may be used within environment 200 of FIG. 2 and FIG. 4. Device 500 may correspond to a controller that controls various features of one or more of the system components: looped cooling system 100, module 130, pump 210, heat exchanger 410, water system 420, reservoir 430, and/or air supply 440. Each of looped cooling system 100, module 130, pump 210, heat exchanger 410, water system 420, reservoir 430, and/or air supply 440 may include one or more devices 500 and/or one or more components of device 500.

As shown in FIG. 5, device 500 may include a bus 505, a processor 510, a main memory 515, a read only memory (ROM) 520, a storage device 525, an input device 530, an output device 535, and a communication interface 540.

Bus 505 may include a path that permits communication among the components of device 500. Processor 510 may include a processor, a microprocessor, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or another type of processor that interprets and executes instructions, such as valve control functions for valves associated with coil assembly 120, pump 210, and/or heat exchanger 220. Main memory 515 may include a random access memory (RAM) or another type of dynamic storage device that stores information or instructions for execution by processor 510. ROM 520 may include a ROM device or another type of static storage device that stores static information or instructions for use by processor 510. Storage device 525 may include a magnetic storage medium, such as a hard disk drive, or a removable memory, such as a flash memory.

Input device 530 may include a component that permits an operator to input information to device 500, such as a control button, a keyboard, a keypad, or another type of input device. Output device 535 may include a component that outputs information to the operator, such as a light emitting diode (LED), a display, or another type of output device. Communication interface 540 may include any transceiver-like component that enables device 500 to communicate with other devices or networks. In some implementations, communication interface 540 may include a wireless interface, a wired interface, or a combination of a wireless interface and a wired interface.

Device 500 may perform certain operations, as described in detail below. Device 500 may perform these operations in response to processor 510 executing software instructions contained in a computer-readable medium, such as main memory 515. A computer-readable medium may be defined as a non-transitory memory device. A memory device may include memory space within a single physical storage device or memory space spread across multiple physical storage devices.

The software instructions may be read into main memory 515 from another computer-readable medium, such as storage device 525, or from another device via communication interface 540. The software instructions contained in main memory 515 may direct processor 510 to perform processes, such as controlling the size of an inlet or an outlet based on a temperature of airflow and/or a temperature of a liquid. Alternatively, hardwired circuitry may be used in place of or in combination with software instructions to implement processes described herein. Thus, implementations described herein are not limited to any specific combination of hardware circuitry and software.

In some implementations, device 500 may include additional components, fewer components, different components, or differently arranged components than are shown in FIG. 5. For example, device 500 may include temperature sensors, fluid flow sensors, or the like.

FIG. 6 illustrates a graph of example temperature of airflow heated by a module, subject to a particular electrical load, and cooled by a looped cooling system. The graph of FIG. 6 illustrates the temperature of airflow measured at input fan 132 of module 130 (e.g., a UPS module) after the airflow is cooled by looped cooling system 100. In FIG. 6, module 130 is subject to an electrical load of 600 kilowatts (kW) and is suddenly subjected to an electrical load of 1200 kW after approximately five minutes (e.g., to simulate a failure of a redundant device, thereby causing module 130 to be subjected to the electrical load of 1200 kW).

As shown in FIG. 6, the temperature of the airflow is approximately 23 degrees Celsius (C) when module 130 is subject to an electrical load of 600 kilowatts (kW). As further shown FIG. 6, the temperature of the airflow rises to 24 degrees C. over approximately 90 minutes when module 130 is suddenly subjected to 1200 kW of electrical load. As a result, looped cooling system 100 maintains the temperature of the airflow at 24 degrees C. even when the electrical load, provided by module 130 is doubled, such as in a situation where module 130 is to bear an extra electrical load (e.g., when a redundant device, associated with module 130, fails, thereby causing module 130 to bear the extra electrical load).

While particular temperatures of airflow are illustrated in FIG. 6, in practice, the actual temperatures may vary from what is described. For example, looped cooling system 100 may provide an airflow having a lower temperature than what is shown in FIG. 6 based on operating conditions of looped cooling system 100, based on the type of module 130, based on layout of a particular facility in which looped cooling system 100 is implemented, and/or based on some other factors.

FIG. 7 illustrates a chart illustrating example power consumption of a looped cooling system and a non-looped cooling system. As shown in FIG. 7, a non-looped cooling system, such as a direct exchange (DX) computer room air conditioner (DX CRAC) may consume approximately 40.7 kW of power to operate, whereas looped cooling system 100 (as described above), by comparison under similar operating conditions, may consume approximately 2.5 kW.

While particular power consumptions of systems are illustrated in FIG. 7, in practice, the actual power consumptions may vary from what is described. For example, looped cooling system 100 may consume less power than what is shown in FIG. 7 based on operating conditions of looped cooling system 100, based on the type of module 130, based on layout of a particular facility in which looped cooling system 100 is implemented, and/or based on some other factors.

As described above, looped cooling system 100 may cool airflow, provided by module 130 and heated by components of module 130 and provide, back to module 130, to allow module 130 to use the cooled airflow to cool the components. Further, looped cooling system 100 may receive a refrigerant, to cool the airflow, and provide the refrigerant, after absorbing heat from the airflow, to heat rejection system 220. As described above, heat rejection system 220 may remove heat from the refrigerant and provide the refrigerant, after removing the heat, back to looped cooling system 100. As a result, the airflow is cooled and recycled back to module 130. Further, the refrigerant is recycled and provided back to looped cooling system 100.

The foregoing description provides illustration and description, but is not intended to be exhaustive or to limit the possible implementations to the precise form disclosed. Modifications and variations are possible in light of the above disclosure or may be acquired from practice of the implementations.

It will be apparent that different examples of the description provided above may be implemented in many different forms of software, firmware, and hardware in the implementations illustrated in the figures. The actual software code or specialized control hardware used to implement these examples is not limiting of the implementations. Thus, the operation and behavior of these examples were described without reference to the specific software code—it being understood that software and control hardware can be designed to implement these examples based on the description herein.

Even though particular combinations of features are recited in the claims and/or disclosed in the specification, these combinations are not intended to limit the disclosure of the possible implementations. In fact, many of these features may be combined in ways not specifically recited in the claims and/or disclosed in the specification. Although each dependent claim listed below may directly depend on only one other claim, the disclosure of the possible implementations includes each dependent claim in combination with every other claim in the claim set.

No element, act, or instruction used in the present application should be construed as critical or essential unless explicitly described as such. Also, as used herein, the article “a” is intended to include one or more items and may be used interchangeably with “one or more.” Where only one item is intended, the term “one” or similar language is used. Further, the phrase “based on” is intended to mean “based, at least in part, on” unless explicitly stated otherwise. 

What is claimed is:
 1. A system comprising: an evase through which heated airflow flows therethrough when the system is in operation; and a coil assembly coupled with the evase and a heat rejection system and configured, when the system is in operation, to: receive a refrigerant; receive the heated airflow from the evase; transfer heat from the heated airflow to the refrigerant to reduce a temperature of the heated airflow to form a cooled airflow; provide an egress through which the cooled airflow exits therefrom; and provide the refrigerant, after transferring the heat from the heated airflow to the refrigerant, to the heat rejection system to permit the heat rejection system to remove heat from the refrigerant to reduce a temperature of the refrigerant, and to provide the refrigerant, after removing the heat from the refrigerant, to the coil assembly.
 2. The system of claim 1, further comprising: a pump through which an initial supply of the refrigerant is provided to the coil assembly, where when receiving the refrigerant, the coil assembly is further to receive the refrigerant based on receiving the initial supply of the refrigerant from the pump and based on providing the refrigerant to the heat rejection system after receiving the initial supply of the refrigerant.
 3. The system of claim 1, wherein the refrigerant, received by the coil assembly, includes the refrigerant provided by the coil assembly.
 4. The system of claim 1, wherein the evase forms a truncated-pyramid shape through which the heated airflow flows therethrough.
 5. The system of claim 1, wherein the evase is configured to provide the heated airflow across the coil assembly via a surface provided at a top portion of the evase.
 6. The system of claim 1, wherein the coil assembly comprises: a surface to receive the heated airflow from the evase; a plurality of coils to receive the refrigerant; a plurality of fins provided on the surface to distribute the heated airflow across the plurality of coils; and a plurality of headers to provide the refrigerant, from the plurality of coils, to the heat rejection system.
 7. The system of claim 6, wherein each of the plurality of coils includes a curvature to direct the heated airflow towards the plurality of coils.
 8. The system of claim 6, wherein each of the plurality of fins includes angles of inclinations to direct the heated airflow towards the plurality of coils.
 9. The system of claim 1, wherein the evase receives the heated airflow from a module and wherein the cooled airflow is provided to the module via the egress, the module including an uninterruptible power supply (UPS), a computing device, or a server.
 10. A system comprising: an evase through which heated airflow, received from a module, flows therethrough when the system is in operation; and a coil assembly coupled with the evase and a heat rejection system and configured, when the system is in operation, to: receive a refrigerant, an initial supply of the refrigerant being received from a pump; receive the heated airflow from the evase; transfer heat from the heated airflow to the refrigerant to reduce a temperature of the heated airflow to form a cooled airflow; provide an egress through which the cooled airflow exits therefrom towards the module; and provide the refrigerant, after transferring the heat from the heated airflow to the refrigerant, to the heat rejection system to permit the heat rejection system to remove heat from the refrigerant to reduce a temperature of the refrigerant, and to provide the refrigerant, after removing the heat from the refrigerant, to the coil assembly.
 11. The system of claim 10, wherein the refrigerant, received by the coil assembly, includes the refrigerant provided by the coil assembly.
 12. The system of claim 10, wherein the evase forms a truncated-pyramid shape through which the heated airflow flows therethrough.
 13. The system of claim 10, wherein the coil assembly comprises: a surface to receive the heated airflow from the evase across a substantial surface area of the surface; a plurality of coils to receive the refrigerant; a plurality of fins provided on the surface to distribute the heated airflow across the plurality of coils; and a plurality of headers to provide the refrigerant, from the plurality of coils, to the heat rejection system.
 14. The system of claim 13, wherein each of the plurality of fins includes angles of inclinations to direct the heated airflow towards the plurality of coils.
 15. A system comprising: an evase through which heated airflow, formed by a module, flows therethrough when the system is in operation; and a coil assembly coupled with the evase and a heat rejection system and configured, when the system is in operation, to: receive a refrigerant; receive the heated airflow from the evase; transfer heat from the heated airflow to the refrigerant to reduce a temperature of the heated airflow to form a cooled airflow; provide an egress through which the cooled airflow exits therefrom, towards the module; and provide the refrigerant, after transferring the heat from the heated airflow to the refrigerant, to the heat rejection system to permit the heat rejection system to remove heat from the refrigerant to reduce a temperature of the refrigerant.
 16. The system of claim 15, wherein the refrigerant, received by the coil assembly, includes the refrigerant provided by the coil assembly.
 17. The system of claim 15, wherein the evase forms a truncated-pyramid shape through which the heated airflow flows therethrough.
 18. The system of claim 15, wherein the coil assembly comprises: a surface to receive the heated airflow from the evase across a substantial surface area of the surface; a plurality of coils to receive the refrigerant; a plurality of fins provided on the surface to distribute the heated airflow across the plurality of coils; and a plurality of headers to provide the refrigerant, from the plurality of coils, to the heat rejection system.
 19. The system of claim 18, wherein each of the plurality of coils includes a curvature to direct the heated airflow towards the plurality of coils.
 20. The system of claim 18, wherein each of the plurality of fins include angles of inclinations to direct the heated airflow towards the plurality of coils. 